Nondissipative Addressing for Time-Division SQUID Multiplexing

Abstract : Recent and future astronomical instruments are based on a focal plane mapped by a large array of superconducting bolometers. Cryogenic analog multiplexing readout techniques, based on superconducting quantum interference devices (SQUIDs), are currently developed to achieve the readout of large arrays of this kind of low noise background-limited detectors. To effectively reduce the number of cryogenic wires (particularly, SQUID biasing), line/column addressing is currently used in time-division multiplexing, i.e., same biasing is applied to a few SQUIDs (on a line) of different columns. This technique should dramatically increase power consumption if parallel biasing is applied via resistors to isolate each column; the power budget is particularly limited on this kind of front-end cryogenic readout. A design with one transformer per SQUID is also used to read out SQUID biased in series with no excess of consumption and crosstalk. We propose here a new biasing technique using simple surface-mounted capacitors, which is easier to implement. These capacitors are used to parallel bias SQUIDs without additional Joule effect while minimizing crosstalk. However, capacitors do not allow dc biasing and need a current mean value equal to zero to avoid biasing source saturation. We have then tested square current biasing through capacitors on a commercial SQUID. This measurement shows that capacitors are able to proper bias SQUID and then to perform a nondissipative addressing for time-division SQUID multiplexing.
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Journal articles
IEEE Transactions on Applied Superconductivity, Institute of Electrical and Electronics Engineers (IEEE), 2011, 21 (6), pp.3652-3654. <10.1109/TASC.2011.2165708>


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Contributor : Damien Prêle <>
Submitted on : Wednesday, February 15, 2012 - 3:26:08 PM
Last modification on : Tuesday, October 28, 2014 - 6:17:53 PM

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D. Prêle, F. Voisin, J. Martino, M. Piat, E. Bréelle. Nondissipative Addressing for Time-Division SQUID Multiplexing. IEEE Transactions on Applied Superconductivity, Institute of Electrical and Electronics Engineers (IEEE), 2011, 21 (6), pp.3652-3654. <10.1109/TASC.2011.2165708>. <hal-00670507>

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