"HF Performance Characterization and Prediction of 2D Redistribution Layer Interconnects in a 3D-Integrated Circuit Stack"

J. Roullard , S. Capraro (1) , T. Lacrevaz , L. Cadix , E. Eid , A. Farcy (2) , B. Flechet

1 DIOM - Dispositifs et Instrumentation en Optoélectronique et micro-ondes
2 PPrime [Poitiers] - Institut Pprime [UPR 3346]

Domaines: Micro et nanotechnologies/Microélectronique

J. Roullard, S. Capraro, T. Lacrevaz, L. Cadix, E. Eid, et al.. "HF Performance Characterization and Prediction of 2D Redistribution Layer Interconnects in a 3D-Integrated Circuit Stack". IEEE Signal Propagation on Interconnects, May 2010, Hidelsheim, Germany. ⟨hal-00604328⟩