Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking

E. Eid (1) , T. Lacrevaz (1) , S. de Rivaz (1) , C. Bermond (1) , B. Fléchet (1) , F. Calmon , C. Gontrand , A. Farcy (2, 1) , P. Ancey (3)

1 IMEP-LAHC - Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation
2 LEA - Laboratoire d'Études Aérodynamiques
3 ST-CROLLES - STMicroelectronics [Crolles]

Domaines: Optique / photonique

E. Eid, T. Lacrevaz, S. de Rivaz, C. Bermond, B. Fléchet, et al.. Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking. Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking, Sep 2009, San Francisco, United States. ⟨hal-00602866⟩