T. Li, Z. Suo, S. P. Lacour, and S. Wagner, Compliant thin film patterns of stiff materials as platforms for stretchable electronics, Journal of Materials Research, vol.20, issue.12, pp.3274-3277, 2005.
DOI : 10.1063/1.1806275

D. Y. Khang, H. Q. Jiang, Y. Huang, and J. A. Rogers, A Stretchable Form of Single-Crystal Silicon for High-Performance Electronics on Rubber Substrates, Science, vol.311, issue.5758, pp.208-212, 2006.
DOI : 10.1126/science.1121401

J. Song, H. Jiang, Z. J. Liu, D. Y. Khang, Y. Huang et al., Buckling of a stiff thin film on a compliant substrate in large deformation, International Journal of Solids and Structures, vol.45, issue.10, pp.3107-3121, 2008.
DOI : 10.1016/j.ijsolstr.2008.01.023

M. Gonzalez, F. Axisa, M. Vanden-bulcke, D. Brosteaux, B. Vandevelde et al., Design of metal interconnects for stretchable electronic circuits, Microelectronics Reliability, vol.48, issue.6, pp.825-832, 2008.
DOI : 10.1016/j.microrel.2008.03.025

J. A. Rogers, T. Someya, and Y. Huang, Materials and Mechanics for Stretchable Electronics, Science, vol.327, issue.5973, pp.1603-1607, 2010.
DOI : 10.1126/science.1182383
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.455.4028

Y. Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren et al., In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect, Journal of Materials Research, vol.24, issue.12, pp.3573-3582, 2009.
DOI : 10.1073/pnas.0702927104

Y. Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren et al., The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit, Journal of Micromechanics and Microengineering, vol.20, issue.7, p.75036, 2010.
DOI : 10.1088/0960-1317/20/7/075036

T. Li and Z. Suo, Ductility of thin metal films on polymer substrates modulated by interfacial adhesion, International Journal of Solids and Structures, vol.44, issue.6, pp.1696-1705, 2007.
DOI : 10.1016/j.ijsolstr.2006.07.022

N. Lu, X. Wang, Z. Suo, and J. Vlassak, Metal films on polymer substrates stretched beyond 50%, Applied Physics Letters, vol.91, issue.22, p.221909, 2007.
DOI : 10.1063/1.2817234

N. Lu, J. Yoon, and Z. Suo, Delamination of stiff islands patterned on stretchable substrates, International Journal of Materials Research, vol.98, issue.8, pp.717-721, 2007.
DOI : 10.3139/146.101529

M. Ortiz and A. Pandolfi, Finite???deformation irreversible cohesive elements for three???dimensional crack???propagation analysis, International Journal for Numerical Methods in Engineering, vol.44, issue.9, pp.1267-1282, 1999.
DOI : 10.1002/(SICI)1097-0207(19990330)44:9<1267::AID-NME486>3.3.CO;2-Z
URL : http://aero.caltech.edu/~ortiz/Pubs/1999/OrtizPandolfi1999.pdf

M. J. Van-den-bosch, P. J. Schreurs, and M. G. Geers, A cohesive zone model with a large displacement formulation accounting for interfacial fibrilation, European Journal of Mechanics - A/Solids, vol.26, issue.1, pp.1-19, 2007.
DOI : 10.1016/j.euromechsol.2006.09.003

L. B. Freund and S. Suresh, Thin film materials; Stress, defect formation and surface evolution, 2006.

A. Corigliano and S. Mariani, Parameter identification of a time-dependent elastic-damage interface model for the simulation of debonding in composites, Composites Science and Technology, vol.61, issue.2, pp.191-203, 2001.
DOI : 10.1016/S0266-3538(00)00171-8

T. Ferracin, C. M. Landis, F. Delannay, and T. Pardoen, On the determination of the cohesive zone properties of an adhesive layer from the analysis of the wedge-peel test, International Journal of Solids and Structures, vol.40, issue.11, pp.2889-2904, 2003.
DOI : 10.1016/S0020-7683(03)00076-3

H. Zhao and Y. Wei, Determination of interface properties between micron-thick metal film and ceramic substrate using peel test, International Journal of Fracture, vol.38, issue.2, pp.103-112, 2007.
DOI : 10.1007/s10704-007-9083-4

P. A. Gustafson and A. M. Waas, The influence of adhesive constitutive parameters in cohesive zone finite element models of adhesively bonded joints, International Journal of Solids and Structures, vol.46, issue.10, pp.2201-2215, 2009.
DOI : 10.1016/j.ijsolstr.2008.11.016

G. Geißler and M. Kaliske, Peel process simulation of sealed polymeric film computational modelling of experimental results, Engineering Computations: International Journal for Computer-Aided Engineering and Software, vol.24, pp.586-607, 2007.

K. M. Liechti and J. Wu, Mixed-mode, time-dependent rubber/metal debonding, Journal of the Mechanics and Physics of Solids, vol.49, issue.5, pp.1039-1072, 2001.
DOI : 10.1016/S0022-5096(00)00065-X

O. Van-der-sluis, P. H. Timmermans, E. J. Van-der-zanden, and J. P. Hoefnagels, Analysis of the three-dimensional delamination behavior of stretchable electronics applications, Special volume: Advances in Fracture and Damage Mechanics VIII, pp.9-12, 2010.

A. A. Volinksy, N. R. Moody, and W. W. Gerberich, Interfacial toughness measurements for thin films on substrates, Acta Materialia, vol.50, pp.441-466, 2002.

M. Kolluri, M. H. Thissen, J. P. Hoefnagels, J. A. Van-dommelen, and M. G. Geers, In-situ characterization of interface delamination by a new miniature mixed mode bending setup, International Journal of Fracture, vol.426, issue.3, pp.183-195, 2009.
DOI : 10.1007/s10704-009-9356-1

M. D. Thouless and Q. D. Yang, A parametric study of the peel test, International Journal of Adhesion and Adhesives, vol.28, issue.4-5, pp.176-184, 2008.
DOI : 10.1016/j.ijadhadh.2007.06.006

K. Kim and N. Aravas, Elastoplastic analysis of the peel test, International Journal of Solids and Structures, vol.24, issue.4, pp.417-435, 1988.
DOI : 10.1016/0020-7683(88)90071-6

R. S. Rivlin and A. G. Thomas, Rupture of rubber. I. Characteristic energy for tearing, Journal of Polymer Science, vol.10, issue.3, pp.291-318, 1953.
DOI : 10.1002/pol.1953.120100303

B. H. Kim and C. R. Joe, Single specimen test method for determining fracture energy () of highly deformable materials, Engineering Fracture Mechanics, vol.32, issue.1, pp.155-161, 1989.
DOI : 10.1016/0013-7944(89)90213-0

G. Weber and L. Anand, Finite deformation constitutive equations and a time integration procedure for isotropic, hyperelastic-viscoplastic solids, Computer Methods in Applied Mechanics and Engineering, vol.79, issue.2, pp.173-202, 1990.
DOI : 10.1016/0045-7825(90)90131-5

I. M. Ward and J. Sweeney, An Introduction to the Mechanical Properties of Solid Polymers, 2004.

S. Nemat-nasser, On finite deformation elasto-plasticity, International Journal of Solids and Structures, vol.18, issue.10, p.857872, 1982.
DOI : 10.1016/0020-7683(82)90070-1

J. P. Hoefnagels, J. Neggers, P. H. Timmermans, O. Van-der-sluis, and M. G. Geers, Copper???rubber interface delamination in stretchable electronics, Scripta Materialia, vol.63, issue.8, pp.875-878, 2010.
DOI : 10.1016/j.scriptamat.2010.06.041

Y. Y. Lin, C. Y. Hui, and Y. C. Wang, Modeling the failure of an adhesive layer in a peel test, Journal of Polymer Science Part B: Polymer Physics, vol.4, issue.19, pp.2277-2291, 2002.
DOI : 10.1002/polb.10289

Q. Yao and J. Qu, Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging???Effects of Interface Roughness, Journal of Electronic Packaging, vol.124, issue.2, pp.127-134, 2002.
DOI : 10.1115/1.1459470

S. P. Noijen, O. Van-der-sluis, P. H. Timmermans, and G. Q. Zhang, Numerical prediction of failure paths at a roughened metal/polymer interface, Microelectronics Reliability, vol.49, issue.9-11, pp.1315-1318, 2009.
DOI : 10.1016/j.microrel.2009.06.019

M. A. Gutierrez and S. Krenk, Stochastic Finite Element Methods, Encyclopedia Of Computational Mechanics, pp.657-681
DOI : 10.1016/B0-08-043749-4/03011-1