MEMS resonator temperature compensation

F. Casset (1) , C. Durand (2) , Y. Civet (3) , E. Ollier (1) , J.F. Carpentier (1, 4) , P. Ancey (2) , P. Robert (1)

1 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information
2 ST-CROLLES - STMicroelectronics [Crolles]
3 TIMA - Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés
4 LIMATB - Laboratoire d'Ingénierie des Matériaux de Bretagne

This paper presents the study of an electromechanical resonator temperature compensation principle. It consists in the use of a coating material presenting opposite properties over temperature compared to the silicon resonator structural material. Simulated results, using the FEM Coventor® software, show the great potential of this CMOS compatible principle for industrial perspectives.

Domaines: Micro et nanotechnologies/Microélectronique

F. Casset, C. Durand, Y. Civet, E. Ollier, J.F. Carpentier, et al.. MEMS resonator temperature compensation. 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE 2010), Apr 2010, Bordeaux, France. pp.1 - 5, ⟨10.1109/ESIME.2010.5464619⟩. ⟨hal-00544215⟩