High-throughput optimization of adhesion in multilayers by superlayer gradients

S.Y. Grachev (1) , A. Melich (1) , J.-D. Kamminga (1) , Etienne Barthel (1) , E. Sondergard (1)

1 SVI - Surface du Verre et Interfaces

For adhesion measurements, the superlayer method has recently been developed an overlayer under high compressive stress provides the loading and drives interface delamination. We combined the superlayer method with thickness gradients for high-throughput adhesion measurements In this way, the effect of small modifications of interface chemistry on adhesion in multilayers was assessed in a single test. We used this methodology for an optimisation of the Ti interlayer thickness for adhesion at the SiO2/Ag interface. In addition, we have shown that the method is particularly useful for in-depth investigation of buckling phenomena in connection to interfacial toughness

Domaines: Science des matériaux [cond-mat.mtrl-sci]

S.Y. Grachev, A. Melich, J.-D. Kamminga, Etienne Barthel, E. Sondergard. High-throughput optimization of adhesion in multilayers by superlayer gradients. Thin Solid Films, 2010, 518 (21), pp.6052-6054. ⟨10.1016/j.tsf.2010.06.049⟩. ⟨hal-00533225⟩