300 mm Multi Level Air Gap Integration for Edge Interconnect Technologies and Specific High Performance Applications

R. Gras , F. Gaillard , D. Bouchu , A. Farcy , E. Icard , B. Petitprez , J.C. Le-Denmat , L. Pain , J. Bustos , P.H. Haumesser , P. Brun , G. Imbert (1) , L. Clement , C. Borowiak , M. Rivoire , C. Euvrard , V. Arnal (1) , S. Olivier , S. Moreau , M. Mellier , T. Chevolleau (2) , G. Passemard (1) , J. Torres

1 SIMaP - Science et Ingénierie des Matériaux et Procédés
2 LTM - Laboratoire des technologies de la microélectronique

R. Gras, F. Gaillard, D. Bouchu, A. Farcy, E. Icard, et al.. 300 mm Multi Level Air Gap Integration for Edge Interconnect Technologies and Specific High Performance Applications. IITC, Interconnect Technology Conference, 2008, san francisco, United States. ⟨hal-00398957⟩