Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009)

Tarik Bourouina (1) , B. Courtois (2) , R. Ghodssi (3) , J.M. Karam (4) , A. Soma (5) , H.Y. Yang (6)

1 ESYCOM - Electronique, Systèmes de communication et Microsystèmes
2 CMP - Circuits Multi-Projets
3 Dept. of Electrical and Computer Engineering
4 Memscap
5 Department of Mechanics
6 Center of Nanoscience and Nanotechnology

This Symposium is a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 and in 2007 in Stresa, Italy and in 2008 in Nice, France. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We hope you enjoy the technical presentations of 2 conferences - CAD, Design and Test / Microfabrication, Integration and Packaging -, of 2 joint invited talks, and of a special session on 3D Integration of MEMS.

Mots clés: Technology CAD in general; Modeling and simulation of fabrication processes; Devices and components (sensors; actuators; MEMS/MOEMS libraries and IP; Signal processing; Integrated CAD tools; Numerical simulation; Yield estimation; Failure mechanisms; Fault modeling; Fault simulation and test pattern generation; Mechanical simulation; Thermal evaluation; Interoperability of CAD/CAE tools; Multiphysics simulation; Structured design methodologies; Languages for interchange data among designs and tools; Model order reduction; Integrated processes (micromachining; micromolding); Process integration between MEMS and electronics; Microlithography issues unique to MEMS/MOEMS; Manufacturing; Materials; Assembly technologies; Packaging for harsh environments; MOEMS packaging; RF and microwave packaging; Test structures; actuators); Dimensional measurements; Physical measurements; Failure analysis; Reliability; Characterization; Process monitoring; Non destructive evaluation

Domaines: Micro et nanotechnologies/Microélectronique

Tarik Bourouina, B. Courtois, R. Ghodssi, J.M. Karam, A. Soma, et al.. Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009). EDA Publishing Association. EDA Publishing Association, pp.429, 2009, Proceedings. ⟨hal-00395521⟩