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Resist trimming etch process control using dynamic scatterometry

Abstract : Dynamic scatterometry is an optical metrology technique designed for the in-situ real time process control in the production of microelectronics devices. This technique has many advantages; however the main limitation in the real time context comes from the short data acquisition time for the needed wavelength range. We present here the different tools to perform dynamic scatterometry, such as specific software and hardware tools. We show how these tools can successfully be used to monitor the resist etch process in an industrial etch chamber from Applied Materials equipped with an in-situ ellipsometer. Results from determining CD and thickness shows excellent agreement between the scatterometry measurements and measurements made with a 3D AFM
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Submitted on : Friday, April 10, 2009 - 8:27:58 AM
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Mohamed El Kodadi, Sébastien Soulan, Maxime Besacier, Patrick Schiavone. Resist trimming etch process control using dynamic scatterometry. Microelectronic Engineering, Elsevier, 2008, 86 (issues 4-6), pp.1040-1042. ⟨10.1016/j.mee.2008.12.036⟩. ⟨hal-00374855⟩



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