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Article Dans Une Revue International Journal of Thermal Sciences Année : 2009

A 3D computational model of heat transfer coupled to phase change in multilayer materials with random thermal contact resistance

Résumé

An improved understanding of the heat transfer in materials consisting of two layers (splat and substrate) is essential for many industrial applications. We are interested in the deposition, rapid cooling and solidification of metal droplets (known as splats) brought into contact with a cold substrate. We therefore need to understand the temperature history in both the splat and the substrate, including phase change phenomena. A new model of the thermal contact resistance based on a random distribution of contact points, rather than the uniform distribution commonly used, is presented in this paper. Phase change has been also considered, using the enthalpy-porosity formulation. Simulations have been conducted with the commercial package CFX-4. The computational results for the cooling rate of the splat obtained using the random contact distribution model are in good agreement with available experimental results. In addition, results obtained from the random model provide information on the inhomogeneity affecting the temperature at the interface between the splat and the substrate.

Dates et versions

hal-00345086 , version 1 (08-12-2008)

Identifiants

Citer

Mohamed Amara, V. Timchenko, Mohammed El Ganaoui, Emilio Leonardi, G. de Vahl Davis. A 3D computational model of heat transfer coupled to phase change in multilayer materials with random thermal contact resistance. International Journal of Thermal Sciences, 2009, 48, pp.421-427. ⟨10.1016/j.ijthermalsci.2008.03.008⟩. ⟨hal-00345086⟩
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