Measuring stress intensity factors with a camera: Integrated digital image correlation (I-DIC)

Abstract : A novel ‘integrated' approach coupling image correlation and elastic displacement field identification provides a powerful and accurate tool to evaluate mode I and II stress intensity factors. This technique is applied to silicon carbide subjected to a sandwiched three-point bend test, using digital pictures obtained in optical microscopy where the pixel physical scale is about 2 μm. A crack whose maximum opening is 500 nm can be detected and its geometry identified. The toughness is determined well within a 10% uncertainty.
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François Hild, Stéphane Roux. Measuring stress intensity factors with a camera: Integrated digital image correlation (I-DIC). Comptes Rendus Mécanique, Elsevier Masson, 2006, 334, pp.8-12. ⟨10.1016/j.crme.2005.11.002⟩. ⟨hal-00322201⟩

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