Reliability assessment: New tools for the next generation of packages

Document type :
Journal articles
Complete list of metadatas

https://hal.archives-ouvertes.fr/hal-00313790
Contributor : Isabelle Bord <>
Submitted on : Wednesday, August 27, 2008 - 2:26:23 PM
Last modification on : Wednesday, July 31, 2019 - 10:36:01 AM

Identifiers

  • HAL Id : hal-00313790, version 1

Citation

Isabelle Bord, Bruno Lévrier, Yannick Deshayes, Laurent Béchou, Yves Ousten. Reliability assessment: New tools for the next generation of packages. Journal of Microelectronics and Electronic Packaging, International Microelectronics And Packaging Society (IMAPS), 2008, Volume 5, pp 44-51. ⟨hal-00313790⟩

Share

Metrics

Record views

201