Use of ultra-thin organic silane films for the improvement of gold adhesion to the silicon dioxide wafers for (bio)sensor applications

Mounir Ben Ali (1, 2) , François Bessueille (3) , Jean-Marc Chovelon (4) , Adnane Abdelghani (2) , Nicole Jaffrezic-Renault (3) , Mhamed A. Maaref (2) , Claude Martelet (5)

1 Institut supérieur des sciences appliquées
2 Laboratoire de Physique de Semi-conducteurs et Capteurs
3 SA - Sciences Analytiques
4 IRCELYON - Institut de recherches sur la catalyse et l'environnement de Lyon
5 AMPERE - Ampère

A mono-functional silane reagent, 3-mercaptopropyltrimethoxysilane (MPS) was used to modify the surface of silicon wafers. The structure of the SAMs formed with the MPS was investigated by contact angle measurements, ellipsometry, AFM, and X-ray photoelectron spectroscopy (XPS). The deposition of a metallic gold layer via ultra-high vacuum (UHV) evaporation reveals good adhesion properties on Au/MPS/SiO2/Si structure. The “chemisorption” between the SAM and the gold evaporated layer is confirmed by adhesion tests and optimum curing treatment is found 1 h at 100 °C). This very simple methodology, avoiding the usage of Cr and other metals as undercoating layers and could be proposed further for (bio)sensors applications.

Mots clés: SAM; Silanization; MPS; XPS; Adhesion

Domaines: Energie électrique

Mounir Ben Ali, François Bessueille, Jean-Marc Chovelon, Adnane Abdelghani, Nicole Jaffrezic-Renault, et al.. Use of ultra-thin organic silane films for the improvement of gold adhesion to the silicon dioxide wafers for (bio)sensor applications. Materials Science and Engineering: C, 2008, 28 (5-6), pp.628-632. ⟨10.1016/j.msec.2007.10.048⟩. ⟨hal-00312906⟩