A SAW filter integrated on a silicon passive substrate used for system in package

Abstract : A packaging method for dies containing an electro-mechanical component on a silicon substrate with a polymer seal ring is described in this paper. A Surface Acoustic Wave (SAW) filter, which is a kind of Micro Electro-Mechanical System (MEMS), is used as a capping substrate. Two different polymers are tested, Benzocyclobutene (BCB) and SU-8. The polymer and the assembly processes are described. The package has been characterized mechanically and the influence of the package on the electrical operation of the filter has been evaluated. A finite element thermo-mechanical analysis has been performed to simulate and understand the behaviour of this heterogeneous flip-chip package. This package enables to decrease the size of the assembly around 50% in term of thickness and footprint area without any electrical degradation compared to a stand-alone component.
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Article dans une revue
Sensors and Actuators A: Physical , Elsevier, 2008, 142, pp.185-191. 〈10.1016/j.sna.2007.07.029〉
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https://hal.archives-ouvertes.fr/hal-00312861
Contributeur : Claude Pellet <>
Soumis le : mardi 26 août 2008 - 17:03:22
Dernière modification le : jeudi 7 février 2019 - 14:49:01

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Vincent Georgel, Fabrice Verjus, Eric Van Grunsven, Patrick Poulichet, Gaelle Lissorgues, et al.. A SAW filter integrated on a silicon passive substrate used for system in package. Sensors and Actuators A: Physical , Elsevier, 2008, 142, pp.185-191. 〈10.1016/j.sna.2007.07.029〉. 〈hal-00312861〉

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