A SAW filter integrated on a silicon passive substrate used for system in package

Vincent Georgel 1, 2 Fabrice Verjus 1 Eric Van Grunsven 3 Patrick Poulichet 2 Gaelle Lissorgues 2 Claude Pellet 4 Stéphane Chamaly 5 Tarik Bourouina 2
1 NXP/SIP PROGRAM - System in Package Program
2 ESYCOM - Electronique, Systèmes de communication et Microsystèmes
3 Electronic Packaging and Thin Films
4 IMS - Laboratoire de l'intégration, du matériau au système
5 Temex
Abstract : A packaging method for dies containing an electro-mechanical component on a silicon substrate with a polymer seal ring is described in this paper. A Surface Acoustic Wave (SAW) filter, which is a kind of Micro Electro-Mechanical System (MEMS), is used as a capping substrate. Two different polymers are tested, Benzocyclobutene (BCB) and SU-8. The polymer and the assembly processes are described. The package has been characterized mechanically and the influence of the package on the electrical operation of the filter has been evaluated. A finite element thermo-mechanical analysis has been performed to simulate and understand the behaviour of this heterogeneous flip-chip package. This package enables to decrease the size of the assembly around 50% in term of thickness and footprint area without any electrical degradation compared to a stand-alone component.
Keywords : SAW filter Packaging Integration Polymer
Document type :
Journal articles
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https://hal.archives-ouvertes.fr/hal-00312861
Contributor : Claude Pellet <>
Submitted on : Tuesday, August 26, 2008 - 5:03:22 PM
Last modification on : Thursday, February 7, 2019 - 2:49:01 PM

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IMS-BORDEAUX | ESYCOM | CV_ESYCOM | UNIV-MLV | UPEC-UPEM | IMS-BORDEAUX-FUSION | ESIEE-PARIS

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Vincent Georgel, Fabrice Verjus, Eric Van Grunsven, Patrick Poulichet, Gaelle Lissorgues, et al.. A SAW filter integrated on a silicon passive substrate used for system in package. Sensors and Actuators A: Physical , Elsevier, 2008, 142, pp.185-191. ⟨10.1016/j.sna.2007.07.029⟩. ⟨hal-00312861⟩

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