SURFACE CONDITIONING EFFECT ON VACUUM MICROELECTRONICS COMPONENTS FABRICATED BY DEEP REACTIVE ION ETCHING
Résumé
Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This paper presents a brief summary of electron emission possibilities and the design leading to the fabrication of a lateral field emission diode. First measurement results and the aging of the devices are also discussed.
Domaines
Architectures Matérielles [cs.AR]
Origine : Fichiers produits par l'(les) auteur(s)
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