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Moisture Diffusion in BCB Resins used for MEMS Packaging

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https://hal.archives-ouvertes.fr/hal-00183113
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Submitted on : Monday, October 29, 2007 - 3:33:14 PM
Last modification on : Friday, February 28, 2020 - 12:44:08 PM

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  • HAL Id : hal-00183113, version 1

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Angélique Tetelin, Claude Pellet, Jean-Yves Deletage, Bertrand Carbonne, Yves Danto. Moisture Diffusion in BCB Resins used for MEMS Packaging. Microelectronics Reliability, Elsevier, 2003, 43, pp.1. ⟨hal-00183113⟩

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