State of the art 200 GHz passive components and circuits integrated in advanced thin SOI CMOS technology on High Resistivity substrate

F. Gianesello , D. Gloria , C. Raynaud , S. Montusclat , S. Boret , C. Clément , Ph. Benech (1) , J.M. Fournier (1) , Gilles Dambrine

1 IMEP - Institut de Microélectronique, Electromagnétisme et Photonique

Domaines: Traitement du signal et de l'image [eess.SP]; Micro et nanotechnologies/Microélectronique; Electromagnétisme; Traitement du signal et de l'image [eess.SP]

F. Gianesello, D. Gloria, C. Raynaud, S. Montusclat, S. Boret, et al.. State of the art 200 GHz passive components and circuits integrated in advanced thin SOI CMOS technology on High Resistivity substrate. IEEE SOI Conf. 06, Water fall, 2006, NEW YORK, United States. pp.XX. ⟨hal-00147881⟩