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Zero-level packaging using BCB adhesive bonding and glass wet-etching for W-band applications

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https://hal.archives-ouvertes.fr/hal-00126797
Contributor : Collection Iemn Connect in order to contact the contributor
Submitted on : Friday, January 26, 2007 - 11:04:36 AM
Last modification on : Tuesday, October 19, 2021 - 11:25:08 AM

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  • HAL Id : hal-00126797, version 1

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S. Seok, N. Rolland, P.A. Rolland. Zero-level packaging using BCB adhesive bonding and glass wet-etching for W-band applications. Electronics Letters, IET, 2006, 42, pp.755-757. ⟨hal-00126797⟩

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