Thermodynamic-based interface model for cohesive brittle materials : Application to bond slip in RC structures - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Computer Methods in Applied Mechanics and Engineering Année : 2006

Thermodynamic-based interface model for cohesive brittle materials : Application to bond slip in RC structures

N. Dominguez
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Dates et versions

hal-00115375 , version 1 (21-11-2006)

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  • HAL Id : hal-00115375 , version 1

Citer

Frédéric Ragueneau, N. Dominguez, Adnan Ibrahimbegovic. Thermodynamic-based interface model for cohesive brittle materials : Application to bond slip in RC structures. Computer Methods in Applied Mechanics and Engineering, 2006, 195, pp.7249-7263. ⟨hal-00115375⟩
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