Smart Integrated Electronic Systems

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Analog/RF integrated circuits Monitoring Through-silicon vias Circuit faults 3D integration Microprocessors Education Clocks Current mirror Power supplies Delay variation FDSOI technology Three-dimensional displays Accelerometer Current conveyor Power demand Analog/IF signals Integrated circuit interconnections Convective accelerometer Three-dimensional integrated circuits Integrated circuit testing Analog and RF integrated circuits Brainstorming Transistors Switches Specifications Calibration Copper Test efficiency Thermal sensor Sensors Noise RSA CMOS memory circuits SEU One bit acquisition Carbon nanotube Low power COTS Alternate test Logic gates Indirect testing Bioimpedance Circuits Accelerometers Cu-CNT composites RF test Noise measurement Integrated circuit modeling OQPSK Phase noise Low-cost measurements Advanced PMA STT-MRAM ATE programming Side-channel analysis SRAM Carbon nanotubes Delays MEMS Bandwidth Temperature distribution Process variability Competencies Biosensor Bioimpedance spectroscopy Correlation Analog signals Phase shifter Test Reliability Digital signal processing Secure IC Magnetic tunneling Data fusion Carbon nanotube interconnects BIST Computer architecture Electrothermal analysis 1-bit acquisition Integrated circuit reliability Capacitors Integrated circuit noise Integrated circuits Digital modulation Automatic test pattern generation Digital ATE Evaluation CMOS Heating Test cost reduction Digital electronic circuits 3D Design Integrated circuit design Critical path delay Analytical models Alternate testing Circuit Built-In-Self-Test Time-domain analysis