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Fast active cycling power test bench using dedicated modules assemblies for studying wire bond ageing

Abstract : This paper presents the design of specific samples dedicated to the test of power bond wires (300 µm diameter). The aim is to totally control the test conditions on each bond wire while reducing drastically the power consumption. The samples are integrated in a particular test bench that allows conducting easily ageing tests with an on-line monitoring. The main idea is to solder Power MOSFET dies used as heating sources on an Integrated Metallic Substrate having a high thermal impedance. First, the paper describes the design process, aided by Finite Element simulations. A second part focuses on the realization of the samples and of the test bench. Finally, the first ageing results are presented.
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https://hal.archives-ouvertes.fr/hal-02042449
Contributor : Dauverchain Eric <>
Submitted on : Monday, April 1, 2019 - 10:53:04 AM
Last modification on : Wednesday, May 29, 2019 - 10:04:03 AM
Document(s) archivé(s) le : Tuesday, July 2, 2019 - 1:40:06 PM

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  • HAL Id : hal-02042449, version 1

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Guillaume Pellecuer, Jean-Jacques Huselstein, François Forest, André Chrysochoos, Serge Bontemps. Fast active cycling power test bench using dedicated modules assemblies for studying wire bond ageing. Conférence PCIM Europe, May 2019, Nuremberg, Germany. ⟨hal-02042449⟩

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