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Microelectronic Engineering 85 (2008) 636-639
Large area silicon epitaxy using pulsed DC magnetron sputtering deposition
Pascale Plantin 1, Fatiha Challali 2, Olivier Carriot 2, Frédéric Lainat ( ) 2, Michel Ancilotti 3, Gérard Gadot 2, Pascal Brault ( ) 1
(2008)

Pulsed DC magnetron sputtering is used for deposition of large area crystalline (200 mm) silicon 100nm thin films. p doped Si substrates are flashed (Ts = 900 °C) under high vacuum (5 10-6 Pa) for removing native oxide and restoring surface crystallinity. Subsequent boron doped Si homoepitaxy is obtained at substrate temperature below 500°C for pulse frequency of 150 kHz.
1:  Groupe de recherches sur l'énergétique des milieux ionisés (GREMI)
CNRS : UMR6606 – Université d'Orléans
2:  MHS Electronics
Société privée
3:  MHS Equipment
Société privée
Engineering Sciences/Plasmas

Engineering Sciences/Micro and nanotechnologies/Microelectronics
Magnetron sputtering – Epitaxy – Crystalline silicium layer
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