| Type de publication : |
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Articles dans des revues avec comité de lecture |
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| Titre : |
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A copper-palladium alloy usable as cathode material mode of formation and first examples of catalytic cleavages of carbon-halide bonds |
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| Auteur(s) : |
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J. Simonet 1, P. Poizot 2, L. Laffont 2, 3 |
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| Laboratoire : |
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| Résumé : |
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A palladiated copper (Cu-Pd) interface of well-defined structure is formed by dipping a metallic copper substrate in solutions of palladium sulphate in 0.1 N sulphuric acid. Copper is quasi-immediately covered with a shiny metallic surface, which was characterized as corresponding to a CuPd phase dispersed at the copper interface in nanoparticles. This modified surface was successfully used as a new cathode in the field of bond cleavage reactions, in particular those of the carbon-iodide and carbon-bromide bonds. The accent is put on the potential shift between the use of a regular glassy carbon surface and this particular palladiated interface; the potential shift is so large that it enables the one-electron cleavage of C-I and C-Br bonds probably because transient free alkyl radicals are not electro-active at the potential at which the first electron transfer occurs. |
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Langue du texte
intégral : |
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Anglais |
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| Journal : |
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| Journal of Electroanalytical Chemistry |
| Publisher |
Elsevier |
| ISSN |
0022-0728 (eISSN : 0022-0728) |
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| Audience : |
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internationale |
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| Date de publication : |
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01/06/2006 |
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| Page, identifiant, ... : |
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19-26 |
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