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Journal of Electroanalytical Chemistry (2006) 19-26
A copper-palladium alloy usable as cathode material mode of formation and first examples of catalytic cleavages of carbon-halide bonds
J. Simonet 1, P. Poizot 2, L. Laffont 2, 3
(2006-06-01)

A palladiated copper (Cu-Pd) interface of well-defined structure is formed by dipping a metallic copper substrate in solutions of palladium sulphate in 0.1 N sulphuric acid. Copper is quasi-immediately covered with a shiny metallic surface, which was characterized as corresponding to a CuPd phase dispersed at the copper interface in nanoparticles. This modified surface was successfully used as a new cathode in the field of bond cleavage reactions, in particular those of the carbon-iodide and carbon-bromide bonds. The accent is put on the potential shift between the use of a regular glassy carbon surface and this particular palladiated interface; the potential shift is so large that it enables the one-electron cleavage of C-I and C-Br bonds probably because transient free alkyl radicals are not electro-active at the potential at which the first electron transfer occurs.
1:  Institut des Sciences Chimiques de Rennes
CNRS : UMR6226 – Université de Rennes 1 – Institut National des Sciences Appliquées (INSA) - Rennes – Ecole Nationale Supérieure de Chimie de Rennes
2:  Laboratoire de Réactivité et de Chimie des Solides Amiens
Université de Picardie Jules Verne
3:  Laboratoire des Mécanismes et Transfert en Géologie (LMTG)
CNRS : UMR5563 – Observatoire Midi-Pyrénées – Université Paul Sabatier [UPS] - Toulouse III – Institut de recherche pour le développement [IRD] : UMR154
Physics/Physics/Chemical Physics

Chemical Sciences/Organic chemistry