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Communication Dans Un Congrès Année : 2013

Capillary self-alignment assisted hybrid robotic Handling for Ultra-Thin Die Stacking.

Résumé

Ultra-thin dies are difficult to package because of their fragility and flexibility. Current ultra-thin die integration technology for 3D microsystems relies on robotic pick-andplace machines and machine vision, which has rather limited throughput for high-accuracy assembly of fragile ultra-thin dies. In this paper, we report a hybrid assembly strategy that consists of robotic pick-and-place using a vacuum microgripper, and droplet self-alignment by capillary force. Ultrathin dies with breakable links are chosen as part of the assembly strategy. Experimental results show that we can align ultra-thin (10μm) dies with sub-micron accuracy without machine vision. A fully automatic sequence of stacking several of these dies is demonstrated. Up to 12 ultra-thin dies have been stacked. These early results show that die-to-die integration of ultra-thin dies with higher throughput than the current industry robot is possible by applying both robotic handling and droplet self-alignment to ultra-thin die assembly.
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Dates et versions

hal-00834087 , version 1 (14-06-2013)

Identifiants

  • HAL Id : hal-00834087 , version 1

Citer

Ville Liimatainen, Mohamed Kharboutly, David Rostoucher, Michaël Gauthier, Quan Zhou. Capillary self-alignment assisted hybrid robotic Handling for Ultra-Thin Die Stacking.. IEEE International Conference on Robotics and Automation (ICRA), Jan 2013, Germany. pp.1395 - 1400. ⟨hal-00834087⟩
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