3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules

Bassem Mouawad (1) , Cyril Buttay (1) , Maher Soueidan (1) , Hervé Morel (1) , Bruno Allard (2) , D. Fabregue (3) , Vincent Bley (4)

1 AMPERE - Ampère
2 EE - Ampère, Département Energie Electrique
3 SIMaP - Science et Ingénierie des Matériaux et Procédés
4 LAPLACE-MDCE - Matériaux Diélectriques dans la Conversion d’Energie

The classical wire bonding has several drawbacks that make 3D structures a desirable technology for a high performance power module. An interconnection solution for the power semiconductor dies is presented here: it is based on copper micro-posts that are electroplated on top of the die. The die with its micro-posts is then assembled between two Direct Bonding Copper (DBC) substrates using a direct copper-to-copper bond method. This direct bond method is achieved using a Spark Plasma Sintering (SPS) process machine. Manufacturing and electrical characterization of a power semiconductor die with the micro-posts interconnection is presented in details.

Domaines: Energie électrique

Bassem Mouawad, Cyril Buttay, Maher Soueidan, Hervé Morel, Bruno Allard, et al.. 3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules. 7th CIPS, Mar 2012, Nuremberg, Germany. pp.433-438. ⟨hal-00707741⟩