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| HAL : hal-00707741, version 1 |
| Fiche détaillée |  Récupérer au format |
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| Conference on Integrated Power Systems (CIPS), Nuremberg : Germany (2012) |
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| 3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules |
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| Bassem Mouawad 1Cyril Buttay 1 |
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| (06/03/2012) |
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| The classical wire bonding has several drawbacks that make 3D structures a desirable technology for a high performance power module. An interconnection solution for the power semiconductor dies is presented here: it is based on copper micro-posts that are electroplated on top of the die. The die with its micro-posts is then assembled between two Direct Bonding Copper (DBC) substrates using a direct copper-to-copper bond method. This direct bond method is achieved using a Spark Plasma Sintering (SPS) process machine. Manufacturing and electrical characterization of a power semiconductor die with the micro-posts interconnection is presented in details. |
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| 1 : | Ampère |
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CNRS : UMR5005 – Université Claude Bernard - Lyon I – Institut National des Sciences Appliquées (INSA) - Lyon – Ecole Centrale de Lyon |
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| 2 : | Science et Ingénierie des Matériaux et Procédés (SIMAP) |
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CNRS : UMR5266 – Université Joseph Fourier - Grenoble I – Institut National Polytechnique de Grenoble (INPG) |
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| 3 : | Laboratoire Plasma et Conversion d'Energie (LAPLACE) |
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CNRS : UMR5213 – Université Paul Sabatier [UPS] - Toulouse III – Institut National Polytechnique de Toulouse |
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| Domaine | : | Sciences de l'ingénieur/Energie électrique |
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| hal-00707741, version 1 | |
| http://hal.archives-ouvertes.fr/hal-00707741 | |
| oai:hal.archives-ouvertes.fr:hal-00707741 | |
| Contributeur : Publications Ampère | |
| Soumis le : Mercredi 13 Juin 2012, 13:52:50 | |
| Dernière modification le : Mercredi 13 Juin 2012, 14:52:33 | |
