Low-temperature strength tests and SEM imaging of hydroxide catalysis bonds in silicon

N L Beveridge (1) , a A van Veggel (1) , M Hendry (1) , P Murray (1) , R A Montgomery (1) , E Jesse (2) , J Scott (1) , R B Bezensek (3) , L Cunningham (1) , J Hough (1) , R Nawrodt (1, 4) , S Reid (1) , S Rowan (1)

1 Institute for Gravitational Research [Glasgow]
2 Embry-Riddle Aeronautical University
3 Hunting Energy Services UK
4 Institute of Solid State Physics

Silicon is under consideration as a substrate material for the test masses and suspension elements of gravitational wave detectors of improved sensitivity. Hydroxide catalysis bonding is a candidate technique for jointing silicon elements with the potential for both high strength and low mechanical loss. A future detector with quasi-monolithic silicon final stages may operate at cryogenic temperatures. Here we present the first studies of the strength of siliconsilicon bonds at 77 K (liquid nitrogen temperature) and show characteristic strengths of ∼ 44 MPa are achieved. When comparing cryogenic to room temperature results no significant difference is apparent in the strength. We also show that a minimum thickness of oxide layer of 50 nm is desirable to achieve reliably strong bonds. Bonds averaging 47 nm in thickness are achieved for oxide thicknesses greater than 50 nm.

Mots clés: Physical Sciences

Domaines: Relativité Générale et Cosmologie Quantique [gr-qc]

N L Beveridge, a A van Veggel, M Hendry, P Murray, R A Montgomery, et al.. Low-temperature strength tests and SEM imaging of hydroxide catalysis bonds in silicon. Classical and Quantum Gravity, 2011, 28 (8), pp.85014. ⟨10.1088/0264-9381/28/8/085014⟩. ⟨hal-00690083⟩