The milling process monitoring using 3D envelope method - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Journal of Advanced Materials Research Année : 2012

The milling process monitoring using 3D envelope method

Résumé

This paper proposes a method to vibration analysis in order to on-line monitoring of milling process quality. Adapting envelope analysis to characterize the milling tool materials is an important contribution to the qualitative and quantitative characterization of milling capacity and a step by modeling the three-dimensional cutting process. An experimental protocol was designed and developed for the acquisition, processing and analyzing three-dimensional signal. The vibration envelope analysis is proposed to detect the cutting capacity of the tool with the optimization application of cutting parameters. The research is focused on Hilbert transform optimization to evaluate the dynamic behavior of the machine/ tool/workpiece.
Fichier principal
Vignette du fichier
JAMR-a70.pdf (1.59 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-00661862 , version 1 (20-01-2012)

Identifiants

Citer

Claudiu-Florinel Bisu, Alain Gérard, Miron Zapciu, Olivier Cahuc. The milling process monitoring using 3D envelope method. Journal of Advanced Materials Research, 2012, 423, pp.77-88. ⟨10.4028/www.scientific.net/AMR.423.77⟩. ⟨hal-00661862⟩
77 Consultations
264 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More