Controlling roughness: from etching to nanotexturing and plasma-directed organization on organic and inorganic materials
Résumé
We describe how plasma-wall interactions in etching plasmas lead to either random roughening / nanotexturing of polymeric and Silicon surfaces, or formation of organized nanostructures on such surfaces. We conduct carefully designed experiments of plasma-wall interactions to understand the causes of both phenomena, and present Monte-Carlo simulation results confirming the experiments. We discuss emerging applications in wetting and optical property control, protein adsorption, microfluidics and lab-on-a-chip fabrication and modification, and cost-effective silicon mold fabrication. We conclude with an outlook on the plasma reactor future designs to take advantage of the observed phenomena for new micro and nanomanufacturing processes.
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PEER_stage2_10.1088%2F0022-3727%2F44%2F17%2F174021.pdf (7.51 Mo)
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