Minimal repair under step-stress test

N. Balakrishnan , U. Kamps , M. Kateri

In the one- and multi-sample cases, in the context of life-testing reliability experiments, we introduce minimal repair processes under a simple step-stress test, based on exponential distributions and an associated cumulative exposure model, and then develop likelihood inference for such a model.

Mots clés: Physical Sciences

N. Balakrishnan, U. Kamps, M. Kateri. Minimal repair under step-stress test. Statistics and Probability Letters, 2009, 79 (13), pp.1548. ⟨10.1016/j.spl.2009.03.020⟩. ⟨hal-00542573⟩