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Article Dans Une Revue European Physical Journal: Applied Physics Année : 2009

Femtosecond laser machining and lamination for large-area flexible organic microfluidic chips

Résumé

A hybrid process compatible with reel-to-reel manufacturing is developed for ultra low-cost large-scale manufacture of disposable microfluidic chips. It combines ultra-short laser microstructuring and lamination technology. Microchannels in polyester foils were formed using focused, high-intensity femtosecond laser pulses. Lamination using a commercial SU8-epoxy resist layer was used to seal the microchannel layer and cover foil. This hybrid process also enables heterogeneous material structuration and integration.

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Dates et versions

hal-00480155 , version 1 (03-05-2010)

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C. Khan Malek, Laurent Robert, R. Salut. Femtosecond laser machining and lamination for large-area flexible organic microfluidic chips. European Physical Journal: Applied Physics, 2009, 46 (1), pp.1-5. ⟨10.1051/epjap/2009027⟩. ⟨hal-00480155⟩
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