3D Integration Technologie

Peter Ramm (1) , A. Klumpp (1) , J. Weber (1)

1 Fraunhofer IZM - Fraunhofer Institute for Reliability and Microintegration

3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products (e.g. e-CUBES®). Through Silicon Via (TSV) technologies enable high interconnect performance at relatively high fabrication cost compared to 3D packaging. A post backend-of-line TSV process is introduced as optimized technology for More than Moore products: The ICV-SLID process enables 3D integration of completely fabricated devices. Reliability issues, as thermo-mechanical stress caused by TSV formation and bonding are considered. The technology choice for the e-CUBES automotive application demonstrator is described.

Domaines: Micro et nanotechnologies/Microélectronique

Peter Ramm, A. Klumpp, J. Weber. 3D Integration Technologie. EDA Publishing, pp.3, 2009. ⟨hal-00400672⟩