Measuring stress intensity factors with a camera: Integrated digital image correlation (I-DIC)

François Hild (1) , Stéphane Roux (2)

1 LMT - Laboratoire de Mécanique et Technologie
2 SVI - Surface du Verre et Interfaces

A novel ‘integrated' approach coupling image correlation and elastic displacement field identification provides a powerful and accurate tool to evaluate mode I and II stress intensity factors. This technique is applied to silicon carbide subjected to a sandwiched three-point bend test, using digital pictures obtained in optical microscopy where the pixel physical scale is about 2 μm. A crack whose maximum opening is 500 nm can be detected and its geometry identified. The toughness is determined well within a 10% uncertainty.

Mots clés: Rupture; Photomechanics; Brittle material; Toughness

Domaines: Mécanique des matériaux [physics.class-ph]

François Hild, Stéphane Roux. Measuring stress intensity factors with a camera: Integrated digital image correlation (I-DIC). Comptes Rendus Mécanique, 2006, 334, pp.8-12. ⟨10.1016/j.crme.2005.11.002⟩. ⟨hal-00322201⟩