Megasonic Enhanced Electrodeposition

Jens Georg Kaufmann (1) , Marc Desmulliez (1) , D. Price (2)

1 School of Engineering and Physical Sciences, Electrical and Electronic Engineering department, Mountbatten Building
2 Merlin Circuit Technology LTD

A novel way of filling high aspect ratio vertical interconnection (microvias) with an aspect ratio of >2:1 is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are possible for the manufacturing of interconnections and metal-based MEMS.

Domaines: Autre [cs.OH]

Jens Georg Kaufmann, Marc Desmulliez, D. Price. Megasonic Enhanced Electrodeposition. DTIP 2008, Apr 2008, Nice, France. pp.370-372. ⟨hal-00277743⟩