HIGH DENSITY OUT-OF-PLANE MICROPROBE ARRAY

Huang C.H. Huang C.H. (1) , Chingfu Tsou (1) , Tenghsien Lai (2)

1 Department of Automatic Control Engineering
2 The Graduate Institute of Electrical and Communications Engineering

MEMS technology has been developed rapidly in the last few years. More and more special micro structures were discussed in several publications. However, all of the structures were produced by consist of the three fundamental structures, which included bridge, cantilever and membrane structures. Even the more complex structures were no exception. The cantilever with the property of simple design and easy fabrication among three kinds of fundamental structure, therefore, it was popular used in the design of MEMS device.

Domaines: Autre [cs.OH]

Huang C.H. Huang C.H., Chingfu Tsou, Tenghsien Lai. HIGH DENSITY OUT-OF-PLANE MICROPROBE ARRAY. DTIP 2008, Apr 2008, Nice, France. pp.149-153. ⟨hal-00277698⟩