Through Silicon Vias as Enablers for 3D Systems

E. Jung (1) , Andreas Ostmann (1) , Peter Ramm (1) , Jürgen Wolf (1) , Michael Toepper (1) , Maik Wiemer (1)

1 Fraunhofer IZM - Fraunhofer Institute for Reliability and Microintegration

This special session on 3D TSV’s will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TSV’s.

Domaines: Autre [cs.OH]

E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, et al.. Through Silicon Vias as Enablers for 3D Systems. DTIP 2008, Apr 2008, Nice, France. pp.119-122. ⟨hal-00277691⟩