PACKAGE HERMETICITY TESTING WITH THERMAL TRANSIENT MEASUREMENTS

Andras Vass-Varnai (1) , M. Rencz (1)

1 Department of Electron Devices

The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry.

Domaines: Autre [cs.OH]

Andras Vass-Varnai, M. Rencz. PACKAGE HERMETICITY TESTING WITH THERMAL TRANSIENT MEASUREMENTS. DTIP 2008, Apr 2008, Nice, France. pp.24-27. ⟨hal-00277672⟩