A Novel Thermal Position Sensor Integrated On A Plastic Substrate

A. Petropoulos (1) , G. Kaltsas (1, 2) , D. Goustouridis (1) , A.G. Nassiopoulou (1)

1 Institute of Microelectronics
2 Department of Electronics

A thermal position sensor was fabricated and evaluated. The device consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A novel fabrication technology was implemented which allows direct integration with read out electronics and communication to the macro-world without the use of wire bonding. The fabricated sensing elements are temperature sensitive Pt resistors with an average TCR of 0.0024/C. The device realizes the detection of the position and the motion of a heating source by monitoring the resistance variation of the thermistor array. The application field of such a cost-effective position sensor is considered quite extensive.

Mots clés: Microelectromechanical systems (MEMS); printed-circuit board (PCB); Temperature detection; motion sensor

Domaines: Science des matériaux [cond-mat.mtrl-sci]

A. Petropoulos, G. Kaltsas, D. Goustouridis, A.G. Nassiopoulou. A Novel Thermal Position Sensor Integrated On A Plastic Substrate. THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.121-125. ⟨hal-00202546⟩