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| HAL: hal-00202536, version 1 |
| arXiv: 0801.0997 |
| Detailed view |  Export this paper |
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| THERMINIC 2007, Budapest : Hungary (2007) |
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| A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices |
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| H. Chen 1L. Hsu 1 |
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| (2007-09) |
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| This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability. |
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| 1: | IBM Corporation, New York |
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IBM Corporation |
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| Subject | : | Physics/Condensed Matter/Materials Science |
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| Thermoelectric Cooling Technology |
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| Attached file list to this document: | |||||
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| hal-00202536, version 1 | |
| http://hal.archives-ouvertes.fr/hal-00202536 | |
| oai:hal.archives-ouvertes.fr:hal-00202536 | |
| From: EDA Publishing Association | |
| Submitted on: Monday, 7 January 2008 12:11:07 | |
| Updated on: Monday, 7 January 2008 15:34:32 | |
