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| HAL: hal-00202531, version 1 |
| arXiv: 0801.1003 |
| Detailed view |  Export this paper |
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| THERMINIC 2007, Budapest : Hungary (2007) |
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| Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package |
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| J. Czernohorsky 1B. Maj 1 |
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| (2007-09) |
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| Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA). |
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| 1: | Continental Teves AG |
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Continental Teves AG |
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| 2: | Texas Instruments Dallas |
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Texas Instruments Dallas |
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| Subject | : | Physics/Condensed Matter/Materials Science |
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| Solder die attach – epoxy die attach – absolute die temperatures |
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| Attached file list to this document: | |||||
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| hal-00202531, version 1 | |
| http://hal.archives-ouvertes.fr/hal-00202531 | |
| oai:hal.archives-ouvertes.fr:hal-00202531 | |
| From: EDA Publishing Association | |
| Submitted on: Monday, 7 January 2008 12:11:00 | |
| Updated on: Monday, 7 January 2008 15:42:33 | |
