Effect of Assembly Stiffness and Solder Properties on Thermal Cycle Acceleration Factors

R. Darveaux (1, 2)

1 Amkor Technology Chandler AZ
2 Polytechnic Campus

The impact of assembly stiffness and solder properties on thermal cycle acceleration factors was investigated using a simplified model of an electronic assembly. It was seen that stress - strain hysteresis loops change dramatically with modest changes in assembly stiffness or imposed strain. The impact on strain range or strain energy density saturates as the assembly stiffness significantly exceeds that of the solder. The acceleration factors between various temperature cycle conditions vary with assembly stiffness and solder properties. Hence, standard qualification tests do not accelerate all types of surface mount components equally. Strain energy density appears to be a more robust damage indicator than strain range, based on its lower sensitivity to specific constitutive relations.

Mots clés: Thermal stress; constitutive relations; solder fatigue

Domaines: Architectures Matérielles [cs.AR]

R. Darveaux. Effect of Assembly Stiffness and Solder Properties on Thermal Cycle Acceleration Factors. THERMINIC 2005, Sep 2005, Belgirate, Lago Maggiore, Italy. pp.192-203. ⟨hal-00189473⟩