The Sissy Electro-thermal Simulation System - Based on Modern Software Technologies
Résumé
Due to the increasing component density and operational speed of today's integrated circuits the dissipated power and the chip temperature increases as well. Designers have to consider the thermal effect of the layout already in the conceptual design, when usually the circuit schematic is available only. This paper presents an easy-to-maintain simulation system which provides electro-thermal simulation already in the conceptual design either on chip or on board level.
Origine : Fichiers produits par l'(les) auteur(s)
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