ULTRA FINE PITCH FLAT PANEL DISPLAY PACKAGING USING 3µm CONDUCTIVE PARTICLES

G.-J. Wang (1) , Yi-Chin Lin (1) , Gwo-Sen Lin (2)

1 Department of Mechanical Engineering
2 Wintek Inc.

In this research, dependency of the hardness of the gold bump and process parameters such as the contact area and the load pressure on the contact resistance of the extra fine pitch chip-on-glass (COG) flat panel display (FPD) packaging is investigated. The FJ2530 anisotropic conductive film (ACF) by Sony Inc. containing the currently smallest 3µm conductive particles is implemented to conduct the experiments. Feasibility of the 3µm ACF in ultra-fine pitch COG applications is further examined.Form the experimental results, we found that no special process is required to obtain a satisfied contact resistance for the ultra fine pitch packaging based on the 3µm conductive particles. It can be concluded that the combination of the 3µm conductive particles and the IC gold bumps with hardness 70Hv can lead to a miniaturized device with less cost. For mass production, test sample with pitch space being larger than 10µm is suggested to retain a better reliability.

Mots clés: Ultra fine pitch flat panel display packaging; Chip-on-glass; Anisotropic conductive film

Domaines: Architectures Matérielles [cs.AR]

G.-J. Wang, Yi-Chin Lin, Gwo-Sen Lin. ULTRA FINE PITCH FLAT PANEL DISPLAY PACKAGING USING 3µm CONDUCTIVE PARTICLES. DTIP 2006, Apr 2006, Stresa, Lago Maggiore, Italy. 5 p. ⟨hal-00189250⟩