Thermal Stress Failures: A New Experimental Approach For Prediction and Prevention

M. Hertl (1) , R. Fayolle (1) , D. Weidmann (1) , J.-C. Lecomte (1)

1 Insidix

A new experimental tool for analyzing the topography and deformation of electronics components under thermo-mechanical stress is presented. Application examples are shown for a great variety of components, for localizing and quantifying deformations of electronic assemblies. Cooling and heating cycles following JEDEC type thermal profiles have been applied on different components, both before and after assembly. Simultaneously, real time topography and deformation measurements are obtained. These capabilities constitute a powerful tool for failure prediction, risk evaluation, and accelerated development. The high resolution optical setup allows analysis of deformations in the micrometer range, even for very irregularly shaped surfaces.

Mots clés: topography and deformation measurement; thermo-mechanical solicitation; experimental failure analysis

Domaines: Science des matériaux [cond-mat.mtrl-sci]

M. Hertl, R. Fayolle, D. Weidmann, J.-C. Lecomte. Thermal Stress Failures: A New Experimental Approach For Prediction and Prevention. THERMINIC 2006, Sep 2006, Nice, France. pp.169-174. ⟨hal-00171394⟩