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Communication Dans Un Congrès Année : 2006

Heatring - Smart Investigation of Temperature Impact On Integrated Circuit Devices

A. Nentchev
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  • PersonId : 842517
J. Cervenka
  • Fonction : Auteur
  • PersonId : 842518
S. Selberherr
  • Fonction : Auteur
  • PersonId : 842521

Résumé

To investigate the electrical on-chip-transistor behavior at different temperatures usually the transistor area on the wafer is heated by external heat sources to operate at a specific temperature. To avoid using external heat sources a heatring structure was developed which directly controls the temperature of the investigated transistor area on the wafer, guaranteeing very fast warming up and cooling off duration times. Testing the heatring functionality was performed by electro-thermal simulations, the results of which were verified by measurements. Keywords:
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Dates et versions

hal-00171382 , version 1 (12-09-2007)

Identifiants

  • HAL Id : hal-00171382 , version 1

Citer

A. Nentchev, J. Cervenka, G. Marnaus, H. Enichlmair, S. Selberherr. Heatring - Smart Investigation of Temperature Impact On Integrated Circuit Devices. THERMINIC 2006, Sep 2006, Nice, France. pp.235-238. ⟨hal-00171382⟩

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