Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions

D. Schweitzer (1)

1 Infineon Technologies AG [München]

This paper presents a very straightforward method to compute the transient thermal response to arbitrary power dissipation profiles in electronic devices with multiple heat sources. Using cubic spline interpolation of simulated or measured unit power step response curves (Zth-functions), additional errors due to model reduction can be avoided. No effort has to be spent on the generation of compact models. The simple analytic form of the interpolating splines can be exploited to evaluate the convolution integral of the Zth-functions with arbitrary power profiles at low computational costs. An implementation of the algorithm in a spreadsheet program (EXCEL) is demonstrated. The results are in very good agreement with temperature profiles computed by transient Finite Element simulation but can be obtained in a fraction of the time.

Mots clés: Multisource; Multichip; Thermal transient Simulation

Domaines: Science des matériaux [cond-mat.mtrl-sci]

D. Schweitzer. Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions. THERMINIC 2006, Sep 2006, Nice, France. pp.123-127. ⟨hal-00171367⟩