Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors

S. Kondo (1) , Qiang Yu (1) , T. Shibutani (1) , M. Shiratori (1)

1 Department of Mechanical Engineering and Materials Science

The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mounting technology. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. It is demanded a long-life product which has short development time. However, it is difficult because of interaction between each design factor. The authors have investigated the influence of various design factors on the reliability of soldered joints in BGA model by using response surface method and cluster analysis. By using these techniques, the interaction of all design factors was clarified. Based upon the analytical results, design engineers can rate each factor's effect on reliability and assess the reliability of their basic design plan at the concept design stage.

Mots clés: Interaction; BGA; Sensitivity analysis; Cluster analysis; Reliability

Domaines: Science des matériaux [cond-mat.mtrl-sci]

S. Kondo, Qiang Yu, T. Shibutani, M. Shiratori. Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors. THERMINIC 2006, Sep 2006, Nice, France. pp.101-106. ⟨hal-00171363⟩