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| HAL : hal-00016815, version 1 |
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| Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2004), 12-14 May 2004, Montreux, Switzerland: Special Issue, Analog Integrated Circuits and Signal Processing (2005) Volume 44, Number 2, 107-183 |
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| Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2004), 12-14 May 2004, Montreux, Switzerland: Special Issue, Analog Integrated Circuits and Signal Processing |
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| B. Courtois 1 |
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| (2005) |
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| This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. |
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| 1 : | Techniques of Informatics and Microelectronics for integrated systems Architecture (TIMA) |
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CNRS : UMR5159 – Université Joseph Fourier - Grenoble I – Institut National Polytechnique de Grenoble (INPG) |
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| Domaine | : | Sciences de l'ingénieur/Micro et nanotechnologies/Microélectronique |
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| design – modeling – testing – micromachining – microfabrication – integration and packaging |
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| hal-00016815, version 1 | |
| http://hal.archives-ouvertes.fr/hal-00016815 | |
| oai:hal.archives-ouvertes.fr:hal-00016815 | |
| Contributeur : Lucie Torella | |
| Soumis le : Mercredi 11 Janvier 2006, 14:27:56 | |
| Dernière modification le : Vendredi 10 Février 2006, 09:23:05 | |
